Industries
Injection Molding Solutions for the 3C Electronics Industry.
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The 3C industry (Computers, Communications, and Consumer Electronics) is constantly evolving, driven by innovation, miniaturization, and the growing demand for high-precision components. Manufacturing these products requires the integration of advanced materials and highly repeatable processes to ensure quality, functionality, and durability. At the same time, manufacturers must respond quickly to new designs and technologies while maintaining efficient and reliable production.
LED Lighting Brackets and Display Frames
Componentes compactos y resistentes al calor para sistemas de iluminación y pantallas electrónicas. Diseñados para ofrecer excelente conductividad y una eficiente gestión térmica en procesos de producción de alto volumen.
Connectors and Sockets
Piezas de alta precisión fabricadas en moldes multicavidad con paredes ultradelgadas, indispensables para garantizar una transmisión de señal estable en dispositivos electrónicos y de comunicación.
Precision Gears and Microcomponents
Engranes plásticos y elementos de transmisión que sustituyen componentes metálicos, ofreciendo soluciones más ligeras, silenciosas y rentables para aplicaciones en robótica y dispositivos electrónicos 3C.
Contact Lens Molds and Cases
Moldeo de alta limpieza en PP y PBT con estricto control del espesor y la curvatura. Requiere máxima repetibilidad, ciclos de producción cortos y sistemas automatizados de manipulación y empaque en ambientes controlados.
Components for Smartphones and Tablets
Carcasas de pared delgada, marcos estructurales y módulos ópticos que demandan ciclos ultrarrápidos, alta precisión dimensional y acabados superficiales impecables para dispositivos móviles de última generación.
Components for Laptops and Computers
Cubiertas, bastidores, teclados y carcasas que requieren elevada rigidez, precisión y repetibilidad, permitiendo fabricar equipos portátiles ligeros, resistentes y de alta calidad.
Semiconductor Wafer Carriers
Portadores de alta pureza y propiedades antiestáticas diseñados para el manejo, transporte y almacenamiento seguro de obleas semiconductoras, cumpliendo con los más estrictos estándares de limpieza y estabilidad dimensional.
Technology at Its Finest
Developed specifically for the 3C industry, our solutions combine high speed, maximum precision, and process stability for the production of electronic components. From thin-wall housings to optical microcomponents, Haitian’s electric and servo-hydraulic platforms deliver excellent repeatability, cleanroom compatibility, and intelligent automation, reducing cycle times, material waste, and energy consumption per part.
Multi-Component Molding
From smartphone housings to high-precision connectors, Haitian’s electric and servo-hydraulic platforms enable 2K to 6K processes with excellent repeatability. Their modular design facilitates the efficient production of multi-material parts with high quality standards.
High-Response Systems
Injection speeds of 160 to 500 mm/s, accelerations of up to 2 g, and precise velocity-to-pressure (V/P) switchover control enable the production of optical components, microcomponents, and multi-cavity parts with maximum stability and repeatability.
Liquid Silicone Rubber (LSR) Molding
Specialized LSR units incorporate high-precision metering systems, self-sealing nozzles, vacuum control, and cold-runner systems. They are ideal for microseals, 2K covers, and components manufactured in clean environments with automated integration.
Metal and Ceramic Injection Molding (MIM/CIM)
Zhafir PIM machines provide stable high-pressure control for manufacturing complex metal and ceramic components, such as hinges for foldable displays, watch cases, and fiber-optic ferrules. Haitian provides comprehensive support from material preparation through the sintering process.
Nano Molding (NMT)
Nano Molding Technology (NMT) enables plastic and metal to be bonded together to manufacture lightweight, thin structures with a metallic appearance. High injection accelerations and pressures ensure excellent adhesion between materials such as PPS, PBT, or PA and treated metal alloys.
Compression Molding and IMD
Compression molding ensures excellent flatness and thickness control in large, thin parts. Combined with IML, IMD, and IME technologies, it enables the production of functional surfaces with integrated circuits, graphics, and premium finishes for laptops, mobile phones, and other electronic devices.
Machine Solutions for the 3C Industry
Zhafir VEV Series
Fully electric series designed to deliver high levels of cleanliness, safety, and efficiency in the manufacturing of components for the 3C industry.
Zhafir ZEV Series
Fully electric solution for high-precision molding applications, PIM processes, and the production of parts with superior surface finishes.
Haitian MAV/H Series
High-speed servo-hydraulic series with injection speeds of up to 200 mm/s, ideal for applications requiring speed, precision, and process stability.
Applications
